Wei Wu

Gebundenes Buch

Printed Electronics for Smart Packaging

Beschreibung

This book provides cutting-edge information about materials, technologies and mechanisms of printed electronics, and their applications for the smart packaging.

Autor

Wei Wu is full professor of School of Physics and Technology, Wuhan University. He received the State Scientific Innovation and Pioneer Award in 2023, the 15th Bi Sheng Award of Printing Technology in 2019, the STAM Best Paper Award in 2017, and the Hong Kong Scholars Award in 2014.

Produktdetails

• Verlag: Wiley-VCH
• Artikelnr. des Verlages: 1135116 000
• 1. Auflage
• Seitenzahl: 320
• Erscheinungstermin: 24. Dezember 2025
• Englisch
• Abmessung: 249mm x 177mm x 22mm
• Gewicht: 666g
• ISBN-13: 9783527351169
• ISBN-10: 3527351167
• Artikelnr.: 74138194