
Micro-Fluidic and Micro-electromechanical System Applications
Subtractive Processing of Glass Substrates
Herausgeber: Toan, Nguyen Van; Singh, Tarlochan
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The reference text focuses on covering advanced manufacturing processes to fabricate microfluidic and micro-electromechanical system devices. It covers the fabrication of multiple hole arrays for interconnects, surface roughening of glass for microsystems packaging applications, and fabrication, and characterization of through-glass via for micro-electromechanical system packaging applications. This book: * Presents an overview of subtractive technologies needed to process glass materials for micro-fluidic, and micro-electromechanical system applications. * Discusses the latest developments in...
The reference text focuses on covering advanced manufacturing processes to fabricate microfluidic and micro-electromechanical system devices. It covers the fabrication of multiple hole arrays for interconnects, surface roughening of glass for microsystems packaging applications, and fabrication, and characterization of through-glass via for micro-electromechanical system packaging applications. This book: * Presents an overview of subtractive technologies needed to process glass materials for micro-fluidic, and micro-electromechanical system applications. * Discusses the latest developments in advanced machining techniques based on mechanical energy, chemical energy, plasma energy, and high-temperature methods. * Covers post-processing techniques employed to facilitate the machined glass substrates for the micro-electromechanical system, micro-fluidic, and lab-on-chip applications. * Explains advanced techniques such as nonconventional machining processes, hybrid, and sequential machining methods to process glass. * Illustrates topics such as photoacoustic biosensing, cantilever beam temperature sensor, and parametric effect on machined micro-channels. It is primarily written for senior undergraduates, graduate students, and academic researchers in the fields of manufacturing engineering, industrial engineering, mechanical engineering, production engineering, materials science, and engineering.