Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics
Broschiertes Buch

Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics

Volume 990: Symposium Held April 10 12, 20

Herausgeber: Lin, Qinghuang; Wu, Wen-Li; Ryan, E. Todd
Versandkostenfrei!
Versandfertig in 1-2 Wochen
37,99 €
inkl. MwSt.
PAYBACK Punkte
19 °P sammeln!
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.