Tariq Tashtoush

Broschiertes Buch

Lead-Free Solder Joint's Size and Configuration Effect

Effect on Mechanical Properties, Microstructure, and Aging Kinetics

Beschreibung

The properties of Lead-Free solder joints continue to change over a very long time while in service. The assessment of long-term service life of electronics packages invariably misses the effect of solder joint size and configuration, and may thus end up to be seriously misleading. One of the goals of this book is to develop a fundamental understanding of the effects of solder joint size on the mechanical properties of microstructure and aging kinetics. This understanding will help in the assessment of the reliability of Lead-Free solder joints.

Autor

Dr. T. Tashtoush is an Assistant Professor of Engineering in Texas A&M International University (TAMIU), Laredo, TX. He got his Ph.D. and M.S. degrees in Systems and Industrial Engineering from State University of New York at Binghamton on 2013 and 2009, respectively and his B.S. in Mechanical (Mechatronics, Electo-mechanical) Engineering.

Produktdetails

• Verlag: LAP Lambert Academic Publishing
• Seitenzahl: 152
• Erscheinungstermin: 6. Oktober 2015
• Englisch
• Abmessung: 220mm x 150mm x 10mm
• Gewicht: 244g
• ISBN-13: 9783659778544
• ISBN-10: 3659778540
• Artikelnr.: 43901000