ISTFA 2021
Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis
Versandkostenfrei!
Versandfertig in über 4 Wochen
197,99 €
inkl. MwSt.
PAYBACK Punkte
99 °P sammeln!
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.
Andere Kunden interessierten sich für
