Heteroepitaxial Ge on Si Using III-V Buffers
Versandkostenfrei!
Versandfertig in 6-10 Tagen
43,99 €
inkl. MwSt.
PAYBACK Punkte
22 °P sammeln!
Mitigating the power concerns involved with the aggressive shrinking of silicon (Si) based complementary metal-oxide-semiconductor (CMOS) transistors requires the adoption of high-mobility, alternative materials such as Germanium (Ge). Although the use of Ge in bulk form is cost-prohibitive, creative methods such as the application of Ge on to Si substrate via a buffer layer "bridge" helps drive the feasibility of the use of Ge for novel, low-power applications using standard CMOS processes. This work explores the electrical and material characteristics of MOS capacitors fabricated on crystall...
Mitigating the power concerns involved with the aggressive shrinking of silicon (Si) based complementary metal-oxide-semiconductor (CMOS) transistors requires the adoption of high-mobility, alternative materials such as Germanium (Ge). Although the use of Ge in bulk form is cost-prohibitive, creative methods such as the application of Ge on to Si substrate via a buffer layer "bridge" helps drive the feasibility of the use of Ge for novel, low-power applications using standard CMOS processes. This work explores the electrical and material characteristics of MOS capacitors fabricated on crystallographic Ge integrated on to Si substrate via AlAs/GaAs buffers. Electrical characteristics of different crystallographically oriented Ge integrated on AlAs/GaAs buffers and the tunability of a key device characteristic known as threshold voltage is demonstrated as well. Thus, this research demonstrates the feasibility of the use of Ge integrated on Si via AlAs/GaAs buffer layers for high-speed, low-power electronic devices.
Andere Kunden interessierten sich für
