The increasing demand for mobile and wireless sensing necessitates the use of highly integrated technology featuring small size, low weight, high performance and low cost: micro-electro-mechanical systems (MEMS) can meet this need. The Handbook of MEMS for wireless and mobile applications provides a comprehensive overview of radio frequency (RF) MEMS technologies and explores the use of these technologies over a wide range of application areas. Part one provides an introduction to the use of RF MEMS as an enabling technology for wireless applications. Chapters review RF MEMS technology and…mehr
The increasing demand for mobile and wireless sensing necessitates the use of highly integrated technology featuring small size, low weight, high performance and low cost: micro-electro-mechanical systems (MEMS) can meet this need. The Handbook of MEMS for wireless and mobile applications provides a comprehensive overview of radio frequency (RF) MEMS technologies and explores the use of these technologies over a wide range of application areas.
Part one provides an introduction to the use of RF MEMS as an enabling technology for wireless applications. Chapters review RF MEMS technology and applications as a whole before moving on to describe specific technologies for wireless applications including passive components, phase shifters and antennas. Packaging and reliability of RF MEMS is also discussed. Chapters in part two focus on wireless techniques and applications of wireless MEMS including biomedical applications, such as implantable MEMS, intraocular pressure sensors and wireless drug delivery. Further chapters highlight the use of RF MEMS for automotive radar, the monitoring of telecommunications reliability using wireless MEMS and the use of optical MEMS displays in portable electronics.
With its distinguished editor and international team of expert authors, the Handbook of MEMS for wireless and mobile applications is a technical resource for MEMS manufacturers, the electronics industry, and scientists, engineers and academics working on MEMS and wireless systems.
Produktdetails
Produktdetails
Woodhead Publishing Series in Electronic and Optical Materials
Die Herstellerinformationen sind derzeit nicht verfügbar.
Autorenporträt
Deepak Uttamchandani is Professor of Microsystems Engineering at the University of Strathclyde, UK. Since the late 1980s he has been conducting research in the field of microtechnology including: techniques for the characterisation of micromechanical properties of materials; optically excited microresonator sensors; commercial-foundry-centred microfabrication of MEMS in polysilicon and silicon-on-insulator, MEMS design and radio-frequency (RF) MEMS. He has edited 2 books, guest-edited 2 journals and authored/co-authored around 200 publications. He has been a member of the UK EPSRC ranking panels (responsible for government funding of engineering research), was a member of the Basic Technology programme (org. by the UK government to find emerging technologies) and served on one of the UK Dept of Trade and Industry (DTI) Technology Programme panels in 2004.
Inhaltsangabe
Contributor contact details
Woodhead Publishing Series in Electronic and Optical Materials
Dedication
Preface
Part I: RF MEMS as an enabling technology for wireless applications
Chapter 1: Overview of RF MEMS technology and applications
Abstract:
1.1 Introduction
1.2 Radio frequency microelectromechanical systems (RF MEMS) operation principle and common realizations
1.3 RF MEMS design challenges
1.4 RF MEMS applications
1.5 Conclusion
1.6 Sources of further information and advice
1.7 Acknowledgements
Chapter 2: Overview of wireless techniques for use with MEMS
Abstract:
2.1 Introduction
2.2 Transport layer issues
2.3 Network layer mobility issues
2.4 Data-link layer
2.5 Physical layer
2.6 The wireless link budget
2.7 Physical layer system design
2.8 Conclusion
Chapter 3: RF MEMS fabrication technologies
Abstract:
3.1 Introduction
3.2 MEMS-based technologies for RF circuits with enhanced quality factor and minimized losses
3.3 Technologies for smart RF MEMS
3.4 Highlights on specific key steps in RF MEMS fabrication
3.5 Towards integrated technology for microsystem implementation
3.6 Emerging technologies in wireless applications
3.7 Conclusion
3.8 Acknowledgements
Chapter 4: RF MEMS passive components for wireless applications
Abstract:
4.1 Introduction
4.2 RF MEMS passive components and their applications
4.3 High-performance passive components enabled by RF MEMS technology
4.4 Complex networks based on RF MEMS passive components
4.5 Conclusion
Chapter 5: RF MEMS phase shifters for wireless applications
Abstract:
5.1 Introduction
5.2 Switched-line phase shifter
5.3 Loaded-line phase shifter
5.4 Reflection-type phase shifter
5.5 Distributed-line phase shifter
5.6 Mixed-architectures and exotic phase shifters
5.7 Towards global manufacturing
5.8 Applications
5.9 Conclusion
Chapter 6: RF MEMS antennas for wireless applications
Abstract:
6.1 Introduction
6.2 RF MEMS antennas
6.3 Reconfigurable feeding networks
6.4 Reconfigurable antennas
6.5 Design considerations
6.6 Conclusion and future trends
6.7 Sources of further information and advice
Chapter 7: RF MEMS-based wireless architectures and front-ends
Abstract:
7.1 Introduction
7.2 Communication standards
7.3 Receivers, transmitters and transceivers: basic architectures
7.4 Conventional component technology
7.5 MEMS-based technology: filters, duplexers, switches, tunable devices and architecture
7.6 Diversity in receivers and transmitters
7.7 Multi-input multi-output (MIMO) systems
7.8 Systems-on-a-chip
7.9 Conclusion
Chapter 8: RF MEMS technology for next-generation wireless communications
Abstract:
8.1 Introduction
8.2 RF MEMS technology
8.3 RF MEMS technology for high-performance passive components
8.4 Technology platform for the fabrication of RF MEMS complex circuits
8.5 Some examples of high-performance devices enabled by the RF MEMS technology
8.6 Conclusion
Chapter 9: Wafer-level packaging technology for RF MEMS
Abstract:
9.1 Introduction
9.2 Wafer -level zero-level packaging for RF MEMSSS
9.3 Electrical effects of the packaging material on the packaged devices
Woodhead Publishing Series in Electronic and Optical Materials
Dedication
Preface
Part I: RF MEMS as an enabling technology for wireless applications
Chapter 1: Overview of RF MEMS technology and applications
Abstract:
1.1 Introduction
1.2 Radio frequency microelectromechanical systems (RF MEMS) operation principle and common realizations
1.3 RF MEMS design challenges
1.4 RF MEMS applications
1.5 Conclusion
1.6 Sources of further information and advice
1.7 Acknowledgements
Chapter 2: Overview of wireless techniques for use with MEMS
Abstract:
2.1 Introduction
2.2 Transport layer issues
2.3 Network layer mobility issues
2.4 Data-link layer
2.5 Physical layer
2.6 The wireless link budget
2.7 Physical layer system design
2.8 Conclusion
Chapter 3: RF MEMS fabrication technologies
Abstract:
3.1 Introduction
3.2 MEMS-based technologies for RF circuits with enhanced quality factor and minimized losses
3.3 Technologies for smart RF MEMS
3.4 Highlights on specific key steps in RF MEMS fabrication
3.5 Towards integrated technology for microsystem implementation
3.6 Emerging technologies in wireless applications
3.7 Conclusion
3.8 Acknowledgements
Chapter 4: RF MEMS passive components for wireless applications
Abstract:
4.1 Introduction
4.2 RF MEMS passive components and their applications
4.3 High-performance passive components enabled by RF MEMS technology
4.4 Complex networks based on RF MEMS passive components
4.5 Conclusion
Chapter 5: RF MEMS phase shifters for wireless applications
Abstract:
5.1 Introduction
5.2 Switched-line phase shifter
5.3 Loaded-line phase shifter
5.4 Reflection-type phase shifter
5.5 Distributed-line phase shifter
5.6 Mixed-architectures and exotic phase shifters
5.7 Towards global manufacturing
5.8 Applications
5.9 Conclusion
Chapter 6: RF MEMS antennas for wireless applications
Abstract:
6.1 Introduction
6.2 RF MEMS antennas
6.3 Reconfigurable feeding networks
6.4 Reconfigurable antennas
6.5 Design considerations
6.6 Conclusion and future trends
6.7 Sources of further information and advice
Chapter 7: RF MEMS-based wireless architectures and front-ends
Abstract:
7.1 Introduction
7.2 Communication standards
7.3 Receivers, transmitters and transceivers: basic architectures
7.4 Conventional component technology
7.5 MEMS-based technology: filters, duplexers, switches, tunable devices and architecture
7.6 Diversity in receivers and transmitters
7.7 Multi-input multi-output (MIMO) systems
7.8 Systems-on-a-chip
7.9 Conclusion
Chapter 8: RF MEMS technology for next-generation wireless communications
Abstract:
8.1 Introduction
8.2 RF MEMS technology
8.3 RF MEMS technology for high-performance passive components
8.4 Technology platform for the fabrication of RF MEMS complex circuits
8.5 Some examples of high-performance devices enabled by the RF MEMS technology
8.6 Conclusion
Chapter 9: Wafer-level packaging technology for RF MEMS
Abstract:
9.1 Introduction
9.2 Wafer -level zero-level packaging for RF MEMSSS
9.3 Electrical effects of the packaging material on the packaged devices
9.4 Packaging with hard cap materials
9.5 Packaging with a polymer cap
9.6 Conclusion
Chapter 10: Reliability of RF MEMS
Abstract:
10.1 Introduction
10.2 Overview of failure mechanisms in RF MEMS
10.3 Charging in RF MEMS
10.4 Analytical modelling
10.5 Electrostatic
Rezensionen
"In my opinion this is an excellent book for MEMS in mobile communications" --Professor Hamed Al-Raweshidy, Director of the Wireless Networks and Communications Centre (WNCC), Brunel University, UK
"An excellent introduction to the field for engineers and scientists; it identifies important capabilities and opportunities for MEMS in wireless sensing and communication." --Professor Yogesh B. Gianchandani, University of Michigan, USA
"This comprehensive handbook will be a valuable resource to practitioners in the field, as well as to users and potential users of MEMS technology in wireless and mobile." --Professor Eric M. Yeatman, Imperial College London
Es gelten unsere Allgemeinen Geschäftsbedingungen: www.buecher.de/agb
Impressum
www.buecher.de ist ein Internetauftritt der buecher.de internetstores GmbH
Geschäftsführung: Monica Sawhney | Roland Kölbl | Günter Hilger
Sitz der Gesellschaft: Batheyer Straße 115 - 117, 58099 Hagen
Postanschrift: Bürgermeister-Wegele-Str. 12, 86167 Augsburg
Amtsgericht Hagen HRB 13257
Steuernummer: 321/5800/1497
USt-IdNr: DE450055826