Dong Sun Lee (Kyungnam University, Masan, South Korea), Kit L. Yam (Rutgers University, New Brunswick, New Jersey, USA), Luciano Piergiovanni (Italy University of Milan)

Gebundenes Buch

Food Packaging Science and Technology

Beschreibung

Offers coverage of packaging materials and their properties, industry operations, emerging technologies, active and intelligent packaging. This book features developments in food package concepts and practices, as well as scientific and technical papers.

Autor

Dong Sun Lee, Kit L. Yam, Luciano Piergiovanni

Produktdetails

• Verlag: Taylor & Francis Inc
• Seitenzahl: 656
• Erscheinungstermin: 1. April 2008
• Englisch
• Abmessung: 240mm x 161mm x 39mm
• Gewicht: 1154g
• ISBN-13: 9780824727796
• ISBN-10: 0824727797
• Artikelnr.: 40538264