Engineered Particulate Systems for Chemical Mechanical Planarization
G. Bahar Basim
Broschiertes Buch

Engineered Particulate Systems for Chemical Mechanical Planarization

A Systematic Approach to Slurry Formulation for Oxide CMP

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Chemical mechanical polishing (CMP) is used in microelectronics industry to planarize and pattern metal and dielectric layers. Decrease in the sizes of the devices and introduction of new materials necessitate improved control of the CMP that can be achieved by studying the slurry chemical and particulate properties. In this study, the impacts of slurry particle size distribution and stability on pad-particle-surface interactions are investigated. Impacts of hard and soft (transient) agglomerates on polishing performance are quantified. To stabilize slurries, repulsive force barriers provided ...