Mechatronics brings together computer science, mechanics and electronics. It enables us to improve the performances of embedded electronic systems by reducing their weight, volume, energy consumption and cost. Mechatronic equipment must operate without failure throughout ever-increasing service lives.The particularly severe conditions of use of embedded mechatronics cause failure mechanisms which are the source of breakdowns. Until now, these failure phenomena have not been looked at with enough depth to be able to be controlled.
Mechatronics brings together computer science, mechanics and electronics. It enables us to improve the performances of embedded electronic systems by reducing their weight, volume, energy consumption and cost. Mechatronic equipment must operate without failure throughout ever-increasing service lives.The particularly severe conditions of use of embedded mechatronics cause failure mechanisms which are the source of breakdowns. Until now, these failure phenomena have not been looked at with enough depth to be able to be controlled.
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Autorenporträt
Abdelkhalak El Hami is Professeur des universités at the Institut National des Sciences Appliquées (INSA-Rouen) in France and is in charge of the Normandy Conservatoire National des Arts et Metiers (CNAM) Chair of Mechanics and Head of the department of mechanical engineering of INSA Normandy, as well as several European pedagogical projects. He is an expert in fluid-structure interaction studies, reliability and optimization.
Inhaltsangabe
1. Reliability-Based Design Optimization 2. Non-Destructive Characterization by Spectroscopic Ellipsometry of Interfaces in Mechatronic Devices 3. Method of Characterizing the Electromagnetic Environment in Hyperfrequency Circuits Encapsulated within Metallic Cavities 4. Metrology of Static and Dynamic Displacements and Deformations Using Full-Field Techniques 5. Characterization of Switching Transistors under Electrical Overvoltage Stresses 6. Reliability OF Radio Frequency Power Transistors to Electromagnetic and Thermal Stress 7. Internal Temperature Measurement of Electronic Components 8. Reliability Prediction of Embedded Electronic Systems: the FIDES Guide 9. Study of the Dynamic Contact Between Deformable Solids
1. Reliability-Based Design Optimization 2. Non-Destructive Characterization by Spectroscopic Ellipsometry of Interfaces in Mechatronic Devices 3. Method of Characterizing the Electromagnetic Environment in Hyperfrequency Circuits Encapsulated within Metallic Cavities 4. Metrology of Static and Dynamic Displacements and Deformations Using Full-Field Techniques 5. Characterization of Switching Transistors under Electrical Overvoltage Stresses 6. Reliability OF Radio Frequency Power Transistors to Electromagnetic and Thermal Stress 7. Internal Temperature Measurement of Electronic Components 8. Reliability Prediction of Embedded Electronic Systems: the FIDES Guide 9. Study of the Dynamic Contact Between Deformable Solids
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