Paul S. Ho (Austin University of Texas), Chao-Kun Hu, Martin Gall

Gebundenes Buch

Electromigration in Metals

Fundamentals to Nano-Interconnects

Beschreibung

Learn to assess electromigration reliability, and design more resilient chips, from this comprehensive resource. Building from fundamental physics to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. This is an ideal text for materials scientists and chip design engineers.

Autor

Paul Ho is Professor Emeritus in the Department of Mechanical Engineering and the Texas Materials Institute at the University of Texas at Austin. He has received research awards from the Electrochemical Society, IEEE, IITC and Semiconductor Industry Association, among others.

Produktdetails

• Verlag: Cambridge University Press
• Seitenzahl: 430
• Erscheinungstermin: 12. Mai 2022
• Englisch
• Abmessung: 251mm x 175mm x 19mm
• Gewicht: 978g
• ISBN-13: 9781107032385
• ISBN-10: 1107032385
• Artikelnr.: 63223781