Kazuo Nojiri

Gebundenes Buch

Dry Etching Technology for Semiconductors

Beschreibung

This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.

Autor

Kazuo Nojiri is a CTO of Lam Research Japan. He has 37 years of experience in semiconductor industry. Prior to joining Lam in 2000, he worked for Hitachi Ltd. for 25 years, where he held numerous management positions for Dry Etching and Device Integration. He is also known as a pioneer in the research field of charging damage. He published 38 technical papers and 3 books. In 1984 he was awarded the Okouchi Memorial Prize for the development of ECR plasma etching technology.

Produktdetails

• Verlag: Springer / Springer International Publishing / Springer, Berlin / Tuttle-Mori Agency
• Originaltitel: Hajimete No Handotai Dry Etching Gijutsu
• Artikelnr. des Verlages: 86353428, 978-3-319-10294-8
• 2015
• Seitenzahl: 132
• Erscheinungstermin: 3. November 2014
• Englisch
• Abmessung: 241mm x 160mm x 13mm
• Gewicht: 315g
• ISBN-13: 9783319102948
• ISBN-10: 331910294X
• Artikelnr.: 41175439

Rezensionen

This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits.  The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes.  The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.