DPM Study in Different Doped Nano-particles of SAC305 Pb-free Solder
Doped Nano-particles in SAC305 Pb-free Solder
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The inclusion of nanoparticles in the lead free solder, the trajectory of the nanoparticles throughout the soldering process needs to be monitored since it will influence the formation of the fillet height, inter-metallic compound (IMC) layer and micro-void formation. A two way interactions utilizing both volume of fluid method (VOF) and discrete phase method (DPM) are introduced in the current study to account for the interaction between both the nanoparticles and the molten solder. The nano-reinforced particles that are introduced in the SAC305 solder are titanium oxide (TiO2), Nickel oxide ...
The inclusion of nanoparticles in the lead free solder, the trajectory of the nanoparticles throughout the soldering process needs to be monitored since it will influence the formation of the fillet height, inter-metallic compound (IMC) layer and micro-void formation. A two way interactions utilizing both volume of fluid method (VOF) and discrete phase method (DPM) are introduced in the current study to account for the interaction between both the nanoparticles and the molten solder. The nano-reinforced particles that are introduced in the SAC305 solder are titanium oxide (TiO2), Nickel oxide (NiO) and Iron (III) oxide (Fe2O3) nanoparticles with an approximate diameter of =20nm at different weight percentages of 0.01, 0.05 and 0.15 wt.% for application to ultra-fine 01005 type capacitor. Both experimental and simulation studies were conducted to compare the validity of the new DPM based simulation. The results obtained from the experiment can effectively visualize the distribution of the nanoparticles at the end of the reflow process. The DPM simulation on the other hand is capable of showing detail trajectory of the nanoparticles as it undergoes SAC305 thermal reflow.
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