Kirk Prall

Gebundenes Buch

CMOS Plasma and Process Damage

Beschreibung

This book discusses the complex technology of building CMOS computer chips and covers some of the unusual problems that can occur during chip manufacturing. Readers will learn how plasma and process damage results from the high-energy processes that are used in chip manufacturing, causing harm to the chips, functional failure and reliability problems.

Autor

Kirk D. Prall (M'82) was born in 1958. He received the Ph.D. degree in electrical engineering from the University of New Mexico, Albuquerque, in 1990. He worked for Philips Semiconductors from 1982 to 1991, in the areas of EPROM, ROM, microprocessors. He joined Micron, Inc., Boise, ID, in 1991 working on DRAM, NOR, NAND, and emerging memories. He retired from Micron in 2019 and is currently writing engineering books. He has published several papers and holds more than 200 patents.

Produktdetails

• Verlag: Springer / Springer Nature Switzerland / Springer, Berlin
• Artikelnr. des Verlages: 978-3-031-89028-4
• Seitenzahl: 488
• Erscheinungstermin: 17. Mai 2025
• Englisch
• Abmessung: 241mm x 160mm x 32mm
• Gewicht: 836g
• ISBN-13: 9783031890284
• ISBN-10: 3031890280
• Artikelnr.: 73454573