CHARACTERISING EPOXY MATRIX MATERIAL
RELATIONSHIP BETWEEN PHYSICAL PROPERTIES AND CURING
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In this work the author investigated the effect of the curing conditions such as time and temperature on the physical properties a thermosetting epoxy system. The curing kinetics and thermal behaviour of a setting system was determined experimentally using parallel plate rheology and Differential Scanning Calirometry (DSC). The cure kinetics and thermal behaviour as determined experimentally were used to generate a time-temperature-transformation (TTT) isothermal cure diagram. The TTT diagram was used to characterize the curing process of a thermosetting system. The effect of the curing temper...
In this work the author investigated the effect of the curing conditions such as time and temperature on the physical properties a thermosetting epoxy system. The curing kinetics and thermal behaviour of a setting system was determined experimentally using parallel plate rheology and Differential Scanning Calirometry (DSC). The cure kinetics and thermal behaviour as determined experimentally were used to generate a time-temperature-transformation (TTT) isothermal cure diagram. The TTT diagram was used to characterize the curing process of a thermosetting system. The effect of the curing temperature and time on the glass transition temperature (Tg), dynamic mechanical properties and indentation hardness of the system was determined. These system samples were characterized with the TTT isothermal cure diagram. Tg and dynamic mechanical properties of the epoxy system was determined by means of dynamic mechanical thermal analysis (DMTA). Indentation hardness of the cured epoxy systemwas determined using a Barcol Hardness Tester. It was shown that there is a relationship between the cure conditions and the mechanical properties of an epoxy matrix material.
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