Gebundenes Buch

Artificial Intelligence and Blockchain in Industry 4.0

Beschreibung

The book addresses the challenges in designing blockchain-based secured solutions for Industry 4.0 applications using artificial intelligence. It further provides a comparative analysis of various advanced security approaches such as edge computing, cybersecurity, and cloud computing in the realm of information technology.

This book:
Address the challenges in designing blockchain-based secured solutions for Industry 4.0 applications using artificial intelligenceProvides a comparative analysis of various advanced security approaches such as edge computing, cybersecurity, and cloud computing in the realm of information technologyDiscusses the evolution of blockchain and artificial intelligence technology, from fundamental theories to practical aspectsIllustrates the most recent research solutions that handle the security and privacy threats while considering the resource-constrained in Industry 4.0 devicesShowcases the methods and tools necessary for intelligent data analysis and gives solutions to problems resulting from automated data collection
The text aims to fill the gap between the theories of blockchain and its practical application in business, government, and defense among other areas. It further highlights the challenges associated with the use of blockchain for various industry 4.0 applications such as data analytics, software-defined networks, cyber-physical systems, drones, and cybersecurity. The text is primarily written for senior undergraduate, graduate students, and academic researchers in the fields of electrical engineering, electronics and communication engineering, computer engineering, manufacturing engineering, and industrial engineering.

Autor

Dr. Rohit Sharma is currently working as an Associate Professor in the Department of Electronics and Communication Engineering, SRM Institute of Science and Technology, Delhi NCR Campus Ghaziabad, India. He is an active member of ISTE, IEEE, ICS, IAENG, and IACSIT and Senior member of IEEE. He is an editorial board member and reviewer of more than 12 international journals and conferences, including the topmost journal IEEE Access and IEEE Internet of Things Journal. He serves as a Book Editor for 7 different titles to be published by CRC Press, Taylor & Francis Group, USA and Apple Academic Press, CRC Press, Taylor & Francis Group, USA, Springer, etc. He has received the Young Researcher Award in "2nd Global Outreach Research and Education Summit & Awards 2019" hosted by Global Outreach Research & Education Association (GOREA). He is serving as Guest Editor in SCI journal of Elsevier, CEE. He has actively been an organizing end of various reputed International conferences. He is serving as an Editor and Organizing Chair to 3rd Springer International Conference on Microelectronics and Telecommunication (2019), and have served as the Editor and Organizing Chair to 2nd IEEE International Conference on Microelectronics and Telecommunication (2018), Editor and Organizing Chair to IEEE International Conference on Microelectronics and Telecommunication (ICMETE-2016) held in India, Technical Committee member in "CSMA2017, Wuhan, Hubei, China", "EEWC 2017, Tianjin, China" IWMSE2017 "Guangzhou, Guangdong, China", "ICG2016, Guangzhou, Guangdong, China" "ICCEIS2016 Dalian Liaoning Province, China". Prof. R.P. Mahapatra is B.Tech, M.Tech and Ph.D.. He is currently working at SRM Institute of Science & Technology, NCR Campus as Professor and Head - Computer Science & Engineering and Dean Admissions. Prof. Mahapatra has vast experience of 17 years as an academician, researcher and administrator. During these 17 years, he has worked India and abroad. He has been associated with Mekelle University, Ethopia for more than 2 years. Two candidates have successfully completed their Ph.D. under his supervision and 7 students are perusing their research under his guidance. Prof. Mahapatra has authored more than 70 research papers which are published in international journals like Inderscience, Emerald, Elsevier, IEEE and Springer.He is a fellow member of I.E. (India), Senior member of IACSIT, Singapore, Life member of ISTE, Member of IEEE and many more reputed bodies. Prof. Gwanggil Jeon received the B.S., M.S., and Ph.D. (summa cum laude) degrees from the Department of Electronics and Computer Engineering, Hanyang University, Seoul, Korea, in 2003, 2005, and 2008, respectively. From 2009.09 to 2011.08, he was with the School of Information Technology and Engineering, University of Ottawa, Ottawa, ON, Canada, as a Post-Doctoral Fellow. From 2011.09 to 2012.02, he was with the Graduate School of Science and Technology, Niigata University, Niigata, Japan, as an Assistant Professor. From 2014.12 to 2015.02 and 2015.06 to 2015.07, he was a Visiting Scholar at Centre de Mathématiques et Leurs Applications (CMLA), École Normale Supérieure Paris-Saclay (ENS-Cachan), France. From 2019 to 2020, he was a Prestigious Visiting Professor at Dipartimento di Informatica, Università degli Studi di Milano Statale, Italy. He is currently a Full Professor at Incheon National University, Incheon, Korea. He was a Visiting Professor at Sichuan University, China, Universitat Pompeu Fabra, Barcelona, Spain, Xinjiang University, China, King Mongkut's Institute of Technology Ladkrabang, Bangkok, Thailand, and University of Burgundy, Dijon, France. Dr. Jeon is an IEEE Senior Member, an Associate Editor of Sustainable Cities and Society, IEEE Access, Real-Time Image Processing, Journal of System Architecture, and MDPI Remote Sensing. Dr. Jeon was a recipient of the IEEE Chester Sall Award in 2007, the ETRI Journal Paper Award in 2008, and Industry-Academic Merit Award by Ministry of SMEs and Startups of Korea Minister in 2020.

Produktdetails

• Future Generation of Soft and Intelligent Computing
• Verlag: CRC Press / Taylor & Francis
• Seitenzahl: 334
• Erscheinungstermin: 26. Oktober 2023
• Englisch
• Abmessung: 240mm x 161mm x 23mm
• Gewicht: 453g
• ISBN-13: 9781032460581
• ISBN-10: 103246058X
• Artikelnr.: 69115658