Jiashi Yang

Broschiertes Buch

Analysis of Piezoelectric Semiconductor Structures

Beschreibung

This book presents the mechanics of piezoelectric semiconductor structures where the main electromechanical coupling of interest is the interaction between mechanical fields and semiconduction. This volume stands as the first full book treatment of this multi-physical subject from the mechanics angle. The analysis of piezoelectric semiconductor structures and devices is an emerging and rapidly growing interdisciplinary area involving materials, electronics, and solid mechanics. It has direct applications in the new area of piezotronics and piezo-phototronics. The book is theoretical, beginning with a phenomenological framework and progressing to include solutions to problems fundamental to the theory and application. Dr. Yang illustrates how in piezoelectric semiconductors, mechanical fields interact with semiconduction through the piezoelectrically produced electric fields by mechanical loads. This provides the foundation of piezotronic and piezo-phototronic devices in which semiconduction is induced, affected, manipulated, or controlled by mechanical fields. Also discussing composite structures of piezoelectric dielectrics and nonpiezoelectric semiconductors as well as thermal effects, the book is an ideal basic reference on the topic for researchers.

Autor

Dr. Jiashi Yang received his B.E. and M.E. in Engineering Mechanics in 1982 and 1985 from Tsinghua University, Beijing, China; M.S. in Mechanical Engineering in 1988 from Syracuse University, USA; and Ph.D. in Civil Engineering in 1993 from Princeton University, USA. He was a Postdoctoral Fellow from 1993 to 1994 at the University of Missouri-Rolla, and from 1994 to 1995 at Rensselaer Polytechnic Institute. He was employed by Motorola, Inc. as an engineer from 1995 to 1997. Since 1997 he has been an Assistant, Associate, and Full Professor at the Department of Mechanical and Materials Engineering of University of Nebraska-Lincoln. His main research area is theoretical and numerical modeling of electromechanical materials, structures, and devices.

Produktdetails

• Verlag: Springer / Springer International Publishing / Springer, Berlin
• Artikelnr. des Verlages: 978-3-030-48208-4
• 1st edition 2020
• Seitenzahl: 240
• Erscheinungstermin: 21. Juni 2021
• Englisch
• Abmessung: 235mm x 155mm x 14mm
• Gewicht: 371g
• ISBN-13: 9783030482084
• ISBN-10: 3030482081
• Artikelnr.: 61928710