Lih-Tyng Hwang, Tzyy-Sheng Jason Horng

Gebundenes Buch

3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5g Mobility

Beschreibung

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
_ Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
_ Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab
_ Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
_ Provides chapter-wise review questions and powerpoint slides as teaching tools

Autor

Lih-Tyng Hwang, National Sun Yat-Sen University, Taiwan, obtained BS degree in Mechanical Engineering from National Tsing-Hua University, Hsinchu, Taiwan, earned PhD degree in Electrical and Systems Engineering from University of Pennsylvania, Philadelphia, Pennsylvania. He started his R&D career with MCNC (Microelectronics Center of North Carolina) in Research Triangle Park, North Carolina. In 1994, he continued his career with SPS (Semiconductor Products Sector), Motorola in Tempe, Arizona. He obtained an MBA degree from ASU while he was with SPS. In 2002, he transferred to Motorola Labs in Schaumburg, Illinois, where he actively worked with Motorola's Mobile division. He began his teaching career with National Sun Yat-Sen University, Kaohsiung, in August, 2009. Jason Tzyy-Sheng Horng, National Sun Yat-Sen University, Taiwan, received the B.S.E.E. degree from National Taiwan University, Taipei, Taiwan, in 1985, and the M.S.E.E. and Ph.D. degrees from the University of California at Los Angeles (UCLA), in 1990 and 1992, respectively. Since August 1992, he has been with the Department of Electrical Engineering, National Sun Yat-Sen University (NSYSU), Kaohsiung, Taiwan, where he was the Director of the Telecommunication Research and Development Center (2003 - 2008) and Director of the Institute of Communications Engineering (2004 - 2007), and where he is currently a Professor. He has authored or coauthored over 100 technical publications published in refereed journals and conferences proceedings. He holds over ten patents. His research interests include RF and microwave integrated circuits and components, RF signal integrity for wireless system-in-package, and digitally assisted RF technologies.

Produktdetails

• Wiley - IEEE
• Verlag: Wiley & Sons / Wiley-IEEE Press
• Artikelnr. des Verlages: 1W119289640
• 1. Auflage
• Seitenzahl: 464
• Erscheinungstermin: 19. Juni 2018
• Englisch
• Abmessung: 239mm x 168mm x 28mm
• Gewicht: 839g
• ISBN-13: 9781119289647
• ISBN-10: 1119289645
• Artikelnr.: 51003462