Gebundenes Buch

Machine Learning and Mechanics Based Soft Computing Applications

Beschreibung

This book highlights recent advances in the area of machine learning and robotics-based soft computing applications. The book covers various artificial intelligence, machine learning, and mechanics, a mix of mechanical computational engineering work. The current computing era has a huge market/potential for machine learning, robotics, and soft computing techniques and their applications. With this in view, the book shares latest research and cutting-edge applications useful for professionals and researchers in these areas.

Autor

Dr. Thi Dieu Linh Nguyen is Deputy Head of Science and Technology Department, Hanoi University of Industry, Vietnam (HaUI). She has more than 20 years of academic experience in electronics, IoT, smart garden, and telecommunication. She received Ph.D. in Information and Communication Engineering from Harbin Institute of Technology, Harbin, China, in 2013; she has authored or co-authored many research articles that are published in journals, books, and conference proceedings. She is editor for many books and also a board member for the International Journal of Hyperconnectivity and the Internet of Things (IJHIoT) IGI Global, USA; Information Technology Journal; Mobile Networks and Application Journal and some other reputed journals and international conferences. She has attended many conferences as keynote speaker, conference chair, guest honor; and chaired many technical events in different universities in Vietnam. She can be contacted at [e-mail] / [e-mail] Joan Lu is in the Department of Computer Science and is the research group leader of Information and System Engineering (ISE) in the Center of High Intelligent Computing (CHIC), having previously been a team leader in the IT department of Charlesworth Group publishing company. Professor Lu has published seven academic books and more than 200 peer-reviewed academic papers.

Produktdetails

• Studies in Computational Intelligence 1068
• Verlag: Springer / Springer Nature Singapore / Springer, Berlin
• Artikelnr. des Verlages: 978-981-19-6449-7
• 2023
• Seitenzahl: 340
• Erscheinungstermin: 2. März 2023
• Englisch
• Abmessung: 241mm x 160mm x 23mm
• Gewicht: 738g
• ISBN-13: 9789811964497
• ISBN-10: 9811964491
• Artikelnr.: 64725127