RF and Microwave Microelectronics Packaging
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  • Broschiertes Buch

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. …mehr

Produktbeschreibung
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
  • Produktdetails
  • RF and Microwave Microelectronics Packaging
  • Verlag: Springer / Springer US / Springer, Berlin
  • 2010
  • Seitenzahl: 304
  • Erscheinungstermin: 5. September 2014
  • Englisch
  • Abmessung: 235mm x 155mm x 16mm
  • Gewicht: 468g
  • ISBN-13: 9781489983244
  • ISBN-10: 1489983244
  • Artikelnr.: 41624418
Inhaltsangabe
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.