Er-Ping Li

Electrical Modeling and Design for 3D System Integration (eBook, PDF)

3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

• Format: PDF

Produktbeschreibung

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: * The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems * The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias * Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations * The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards * An equivalent circuit model of through-silicon vias * Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

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Produktdetails

• Verlag: John Wiley & Sons
• Seitenzahl: 384
• Erscheinungstermin: 19. März 2012
• Englisch
• ISBN-13: 9781118166758
• Artikelnr.: 38237447

Autorenporträt

ER-PING LI, PhD, holds an appointment as Chair Professor at Zhejiang University, China, and has also been a principal scientist and director at the Institute of High Performance Computing, Singapore. He is a Fellow of the IEEE and a Fellow of the Electromagnetics Academy. He has received numerous awards and honors in recognition of his professional work from the IEEE and other professional bodies. Dr. Li is a pioneer in the modeling and simulation for signal/power and EMC in integrated circuits and electronic systems packaging. He has chaired or spoken at numerous international conferences and universities, and has also served as editor to several IEEE Transactions.

Inhaltsangabe

Foreword xi Preface xiii 1. Introduction 1 1.1 Introduction of Electronic Package Integration
1 1.2 Review of Modeling Technologies
6 1.3 Organization of the Book
10 2. Macromodeling of Complex Interconnects in 3D Integration 16 2.1 Introduction
16 2.2 Network Parameters: Impedance
Admittance
and Scattering Matrices
19 2.3 Rational Function Approximation with Partial Fractions
25 2.4 Vector Fitting (VF) Method
29 2.5 Macromodel Synthesis
41 2.6 Stability
Causality
and Passivity of Macromodel
48 2.7 Macromodeling Applied to High-Speed Interconnects and Circuits
79 2.8 Conclusion
91 3. 2.5D Simulation Method for 3D Integrated Systems 97 3.1 Introduction
97 3.2 Multiple Scattering Method for Electronic Package Modeling with Open Boundary Problems
98 3.3 Novel Boundary Modeling Method for Simulation of Finite-Domain Power-Ground Planes
127 3.4 Numerical Simulations for Finite Structures
133 3.5 Modeling of 3D Electronic Package Structure
142 3.6 Conclusion
182 4. Hybrid Integral Equation Modeling Methods for 3D Integration 185 4.1 Introduction
185 4.2 2D Integral Equation Equivalent Circuit (IEEC) Method
186 4.3 3D Hybrid Integral Equation Method
220 4.4 Conclusion
238 5. Systematic Microwave Network Analysis for 3D Integrated Systems 241 5.1 Intrinsic Via Circuit Model for Multiple Vias in an Irregular Plate Pair
242 5.2 Parallel Plane Pair Model
281 5.3 Cascaded Multiport Network Analysis of Multilayer Structure with Multiple Vias
305 6. Modeling of Through-Silicon Vias (TSV) in 3D Integration 331 6.1 Introduction
331 6.2 Equivalent Circuit Model for TSV
336 6.3 MOS Capacitance Effect of TSV
351 6.4 Conclusion
356 References
358 Index 361