King-Ning Tu, Chih Chen, Hung-Ming Chen

Electronic Packaging Science and Technology (eBook, PDF)

• Format: PDF

Produktbeschreibung

Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.

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Produktdetails

• Verlag: John Wiley & Sons
• Seitenzahl: 336
• Erscheinungstermin: 13. Dezember 2021
• Englisch
• ISBN-13: 9781119418320
• Artikelnr.: 63205056

Autorenporträt

King-Ning Tu, PhD, is TSMC Chair Professor at the National Chiao Tung University in Taiwan. He received his doctorate in Applied Physics from Harvard University in 1968. Chih Chen, PhD, is Chairman and Distinguished Professor in the Department of Materials Science and Engineering at National Yang Ming Chiao Tung University in Taiwan. He received his doctorate in Materials Science from the University of California at Los Angeles in 1999. Hung-Ming Chen, PhD, is Professor in the Institute of Electronics at National Yang Ming Chiao Tung University in Taiwan. He received his doctorate in Computer Sciences from the University of Texas at Austin in 2003.

Inhaltsangabe

Preface

Chapter 1 Introduction

1.1 Introduction

1.2 Impact of Moore's law on Si technology

1.3 5G technology and AI applications

1.4 3D IC packaging technology

1.5 Reliability science and engineering

1.6 The future of electronic packaging technology

1.7 Outline of the book

References

Figures Caption

Part I (Chapter 2 to Chapter 5)

Chapter 2 Cu-to-Cu and Other Bonding Technologies in Electronic Packaging

2.1 Introduction

2.2 Wire bonding

2.3 Tape automated bonding

2.4 Flip chip solder joint bonding

2.5 Micro-bump bonding

2.6 Cu-to-Cu direct bonding

2.6.1 Critical factors for Cu-to-Cu bonding

2.6.2 Analysis of Cu-to-Cu bonding mechanism

2.6.3 Microstructures at the Cu-to-Cu bonding interface

2.7 Hybrid bonding

2.8 Reliability - Electromigration and temperature cycling tests

References

Figures Caption

Problem

Chapter 3 Randomly Oriented and (111) Uni-directionally Oriented Nanotwin Copper

3.1 Introduction

3.2 Formation mechanism of nanotwin Cu

3.3 In-situ measurement of stress evolution during nano-twin deposition

3.4 Electrodeposition of randomly-oriented nanotwin copper

3.5 Formation of uni-directionally (111)-oriented and nanotwin copper

3.6 Grain growth of [111] oriented nt-Cu

3.7 Uni-directional growth of eta-Cu6Sn5 in microbumps on [111] oriented nt-Cu

3.8 Low thermal-budget Cu-to-Cu bonding using [111]-oriented nt-Cu

3.9 Nanotwin Cu redistribution layer for fanout package and 3D integration

References

Figures Caption

Problems

Chapter 4 Solid-Liquid Interfacial Diffusion Reactions (SLID) between Copper and Solder

4.1 Introduction

4.2 Kinetic consideration of scallop-type growth in SLID

4.3 A simple model for the growth of mono-size hemispheres

4.4 Theory of flux-driven ripening

4.5 Measurement of the nano-channel width between two scallops

4.6 Extremely rapid grain growth in scallop-type Cu6Sn5 in SLID

References

Figures Caption

Problems

Chapter 5 Solid State Reactions between Solder and Copper

5.1 Introduction

5.2 Layer-type growth of IMC in solid state reaction

5.3 Wagner diffusivity

5.4 Kirkendall void formation in Cu3Sn

5.5 Side wall reaction to form porous Cu3Sn in micro-bumps

5.6 Effect of surface diffusion on IMC formation in pillar-type micro-bumps

References

Figures Caption

Problems

Part II (Chapter 6 to Chapter 8)

Chapter 6 Essence of Integrated Circuits and Packaging Design

6.1 Introduction

6.2 Transistor and Interconnect Scaling

6.3 Circuit Design and Large Scale Integration

6.4 System-on-Chip (SoC) and Multi-core Architectures

6.5 System-in-Package (SiP) and Package Technology Evolution

6.6 3D IC Integration and 3D Silicon Integration

6.7 Heterogeneous Integration: An Introduction

References

Figures Caption

Problems

Chapter 7 Performance, Power, Thermal and Reliability

7.1 Introduction

7.2 Transistors and Memories Basics

7.3 Performance: A Race in Early IC Design

7.4 Trending in Low Power

7.5 Tradeoff between Performance and Power

7.6 Power Delivery and Clock Distribution Networks

7.7 Low Power Design Ar