Richard K. Ulrich, Leonard W. Schaper

Integrated Passive Component Technology

Herausgegeben:Ulrich, Richard K.; Schaper, Leonard W.

• Gebundenes Buch

Produktbeschreibung

This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.
_ Describes the processes available for creating integrated passives, measuring their properties, and applying them.
_ Brings reader up to date in a fast-moving technology.
_ Enables reader to implement the technology into a manufacturing environment.
_ Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.
_ Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.

Produktdetails

• Verlag: Wiley & Sons
• 1. Auflage
• Seitenzahl: 379
• Erscheinungstermin: 30. Juni 2003
• Englisch
• Abmessung: 240mm x 161mm x 26mm
• Gewicht: 685g
• ISBN-13: 9780471244318
• ISBN-10: 0471244317
• Artikelnr.: 11429397

Autorenporträt

RICHARD K. ULRICH, PhD, is a professor of Chemical Engineering at the University of Arkansas at Fayetteville. He is a NEMI committee member, a Visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society's Dielectric Science and Technology Division. LEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives.

Inhaltsangabe

Introduction. Characteristics and Performance of Planar Resistors.
Integrated Resistor Materials and Processes. DIelectric Materials for
Integrated Capacitors. Size and Configuration for Integrated Capacitors.
Processing Integrated Capacitors. Defect and Yield Issues. Electrical
Performance of Integrated Capacitors. Decoupling. Integrated Inductors.
Modeling Integrated Resistors and inductors for Microwave Applications.
Other Applications and Integration Technologies. The Economic of Embedded
Passives. The Future of Integrated Passives.

Rezensionen

"...an interesting and useful book; I wholeheartedly recommend it."(Circuit World, Vol.30, No. 2003)

"...a comprehensive look at the reasons and current challenges...[of integrating] passive devices into board or IC...just the right dose of the math to explain the physics and theory behind the technology." (IEEE Circuits & Devices Magazine, Jan/Feb 2005)

"...an interesting and useful book; I wholeheartedly recommend it."(Circuit World, Vol.30, No. 2003)