Suchergebnisse für ""John H. Lau""
22 Artikel gefunden
Suchfilter
Cover Solder Joint Reliability (eBook, PDF)
John H. Lau 
Solder Joint Reliability (eBook, PDF)
eBook, PDF

161,95 €
Cover Chiplet Design and Heterogeneous Integration Packaging
John H. Lau 
Chiplet Design and Heterogeneous …
Broschiertes Buch

98,99 €
Cover Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau 
Flip Chip, Hybrid Bonding, Fan-In, and …
Gebundenes Buch

91,99 €
Cover Chiplet Design and Heterogeneous Integration Packaging
John H. Lau 
Chiplet Design and Heterogeneous …
Gebundenes Buch

136,99 €
Cover Semiconductor Advanced Packaging
John H. Lau 
Semiconductor Advanced Packaging
Broschiertes Buch

83,99 €
Cover Semiconductor Advanced Packaging
John H. Lau 
Semiconductor Advanced Packaging
Gebundenes Buch

121,99 €
Cover Fan-Out Wafer-Level Packaging
John H. Lau 
Fan-Out Wafer-Level Packaging
Broschiertes Buch

83,99 €
Cover Heterogeneous Integrations
John H. Lau 
Heterogeneous Integrations
Gebundenes Buch

121,99 €
Cover Fan-Out Wafer-Level Packaging
John H. Lau 
Fan-Out Wafer-Level Packaging
Gebundenes Buch

113,99 €
Cover Solder Joint Reliability
John H. Lau 
Solder Joint Reliability
Broschiertes Buch

153,99 €
Cover Assembly and Reliability of Lead-Free Solder Joints
John H. Lau, …
Assembly and Reliability of Lead-Free …
Broschiertes Buch

87,99 €
Cover Assembly and Reliability of Lead-Free Solder Joints
John H. Lau, …
Assembly and Reliability of Lead-Free …
Gebundenes Buch

122,99 €
Cover Handbook Of Tape Automated Bonding
John H. Lau 
Handbook Of Tape Automated Bonding
Gebundenes Buch

153,99 €
Cover Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology (eBook, PDF)
John H. Lau 
Flip Chip, Hybrid Bonding, Fan-In, and …
eBook, PDF

137,95 €
Cover Chiplet Design and Heterogeneous Integration Packaging (eBook, PDF)
John H. Lau 
Chiplet Design and Heterogeneous …
eBook, PDF

97,95 €
Cover Semiconductor Advanced Packaging (eBook, PDF)
John H. Lau 
Semiconductor Advanced Packaging …
eBook, PDF

81,95 €
Cover Heterogeneous Integrations (eBook, PDF)
John H. Lau 
Heterogeneous Integrations (eBook, PDF)
eBook, PDF

121,95 €
Cover Fan-Out Wafer-Level Packaging (eBook, PDF)
John H. Lau 
Fan-Out Wafer-Level Packaging (eBook, PDF)
eBook, PDF

81,95 €
Cover Assembly and Reliability of Lead-Free Solder Joints (eBook, PDF)
John H. Lau, …
Assembly and Reliability of Lead-Free …
eBook, PDF

89,95 €
Cover Flip Chip Technologies (Electronic Packaging and Interconnection Series)
John H. Lau 
Flip Chip Technologies (Electronic …
Buch

30,61 €
Cover Contemporary Masters in Criminology
Joan McCord (ed.) / …
Contemporary Masters in Criminology
Gebundenes Buch

115,99 €
Cover Katyn Killings: In the Record
John H. Lauck 
Katyn Killings: In the Record
Buch

12,99 €


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