Failure-Free Integrated Circuit Packages - Cohn, Charles / Harper, Charles A.

Charles Cohn / Charles A. Harper 

Failure-Free Integrated Circuit Packages

Systematic Elimination of Failures Through Reliability Engineering, Failure Analysis, and Material Improvements

Ed. by Charles Cohn and Charles A. Harper
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Produktbeschreibung zu Failure-Free Integrated Circuit Packages

Every major electronics manufacturer is struggling with this problem. Key targets include: IBM, Sony, Phillips, Samsung, Sharp, Maxim, Fujitsu, Agere, Ericsson, MCC, Alcatel, HP, Raytheon, Mentor Graphics, Intel. Sandia Labs offers professional seminars in IC failure analysis. Much IC device work is now done in Asia, particularly Singapore. Western Europe is home to a number of major electronics companies working on the issue. No restrictions to the topic. Though not a textbook and very practically focused, there is a market upon graduate electronics courses focusing on failure mechanisms. Illinois Institute of Technology, San Diego State, UC Berkeley, University of Maryland, and Arizona State are among the US Universities offering such courses.

Produktinformation

  • Abmessung: 237mm x 156mm x 32mm
  • Gewicht: 690g
  • ISBN-13: 9780071434843
  • ISBN-10: 0071434844
  • Best.Nr.: 13577144
...easy to tell that this is one of the most useful books in the field of IC packaging reliability to come along in some time....If the IDMs and packaging foundries would pass this book out to new engineering hires, it might prevent some of those arduous, litigation-infested dramas that occur as customer and buyer try to plant the blame on each other for packaged ICs that fail in the field, seemingly without reason. ...there is a lot of solid meat-and-potatoes content and very little puffery....topics are fairly all-encompassing and include by chapter title, "Fundamentals of IC Package Technolgoy," "Device Reliability" and "Physics and Chemistry of Failures in Packaged Devices." Chapter 5, "Strategies for Locating Failures" by itself would be worth the modest price of admission.
Charles A. Harper is the President of Technology Seminars, Inc., an organization that provides educational training courses for industry professionals. He is a member of the IEEE and the Society of Plastics Engineers, and has taught many courses on plastics, including as an adjunct professor at Johns Hopkins University.

Inhaltsangabe

Chapter 1 Introduction Chapter 2 Fundamentals of IC Package Technologies Chapter 3 Device Reliability Chapter 4 Physics and Chemistry of Failures in Packaged Devices Chapter 5 Strategies for Locating Failures Chapter 6 Failure Analysis Techniques Chapter 7 Examples of Failure Modes Common in Organic IC Packages Chapter 8 Emerging Assembly Materials for IC Packaging Index

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